Simulation and analysis of image sensor's TEC cooling package based on ANSYS Icepak
Wu, Yuheng1,2; Wang, Huachuang1
2016
发表期刊Proceedings of SPIE: 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices
ISSN0277-786X
卷号9686页码:968613
文章类型C
摘要In the use of image sensors such as CCD, CMOS and so on, the noise caused by thermal dark signal will influence the imaging results to a certain extent. Dark current noise exists in every photoelectric devices and it is directly related to the temperature. So it's a principle way that cool the image sensors' temperature to suppress the dark current noise. This article presents a kind of TEC cooling package integrated with four stages TEC, a heat sink and an insulating cavity, to meet the requirement of image sensors' refrigeration. Theoretical analysis of this cooling package was done from the view of heat transfer. The modeling and thermal simulated analysis are performed by finite element simulation analysis software ANSYS Icepak, comparing the experimental results in the conditions of different ambient temperature, different heat load and vacuumizing or filling the cavity. © 2016 SPIE.
关键词Computer Software Cooling Heat Transfer Image Sensors Manufacture Materials Testing Optoelectronic Devices
DOI10.1117/12.2242713
收录类别SCI ; Ei
语种英语
项目资助者Chinese Academy of Sciences, Institute of Optics and Electronics (IOE) ; The Chinese Optical Society (COS)
WOS记录号WOS:000391495500037
引用统计
文献类型期刊论文
条目标识符http://ir.ioe.ac.cn/handle/181551/8513
专题光电探测与信号处理研究室(五室)
作者单位1. Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu
2.610209, China
3. University of Chinese Academy of Sciences, Beijing
4.100039, China
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GB/T 7714
Wu, Yuheng,Wang, Huachuang. Simulation and analysis of image sensor's TEC cooling package based on ANSYS Icepak[J]. Proceedings of SPIE: 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices,2016,9686:968613.
APA Wu, Yuheng,&Wang, Huachuang.(2016).Simulation and analysis of image sensor's TEC cooling package based on ANSYS Icepak.Proceedings of SPIE: 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices,9686,968613.
MLA Wu, Yuheng,et al."Simulation and analysis of image sensor's TEC cooling package based on ANSYS Icepak".Proceedings of SPIE: 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices 9686(2016):968613.
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