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题名:
An algorithm for restoring the wafer surface based on B-spline surface reconstruction
作者: Wang, Nan1,2; Jiang, Wei1,3; Yan, Wei1; Hu, Song1
出版日期: 2013
会议名称: Proceedings of SPIE: International Symposium on Photoelectronic Detection and Imaging 2013: Micro/Nano Optical Imaging Technologies and Applications
会议日期: 2013
学科分类: Algorithms - Interpolation - Redundancy - Silicon wafers - Surface reconstruction
DOI: 10.1117/12.2034199
通讯作者: Wang, N. (705679317@qq.com)
中文摘要: Project lithography has experienced the development of contact, stepper, and step&scan lithography machine. Currently lithography machine has entered the age of twinscan lithography machine. The twinscan lithography machine took advantages of high efficiency and good compatibility, but the focal depth of twinscan lithography machine was only in the nanometer range. In order to guarantee the quality of the exposure, the twinscan lithography machine put forward high request for detecting the map of the wafer surface. Usually, the uniform sampling method and the whole map rebuilding method were used to detect the map of the silicon wafer surface, which is a main cause for the data redundancy. On the other hand, the map reconstructed by this means was not smooth which caused the motor of lithography machine can't response. To avoid these disadvantages, an algorithm for restoring the wafer surface based on B-spline surface reconstruction is proposed in this paper. This method is able to satisfy requirements for the local adaptive refinement, which effectively avoid data redundancy. This method is robust, which means the effect of solving nonlinear problems and inhibiting fuzzy noise is remarkable. The surface reconstructed by this new method is very smooth, which is more suitable for the movement of the motor in lithography machine. © 2013 SPIE.
英文摘要: Project lithography has experienced the development of contact, stepper, and step&scan lithography machine. Currently lithography machine has entered the age of twinscan lithography machine. The twinscan lithography machine took advantages of high efficiency and good compatibility, but the focal depth of twinscan lithography machine was only in the nanometer range. In order to guarantee the quality of the exposure, the twinscan lithography machine put forward high request for detecting the map of the wafer surface. Usually, the uniform sampling method and the whole map rebuilding method were used to detect the map of the silicon wafer surface, which is a main cause for the data redundancy. On the other hand, the map reconstructed by this means was not smooth which caused the motor of lithography machine can't response. To avoid these disadvantages, an algorithm for restoring the wafer surface based on B-spline surface reconstruction is proposed in this paper. This method is able to satisfy requirements for the local adaptive refinement, which effectively avoid data redundancy. This method is robust, which means the effect of solving nonlinear problems and inhibiting fuzzy noise is remarkable. The surface reconstructed by this new method is very smooth, which is more suitable for the movement of the motor in lithography machine. © 2013 SPIE.
收录类别: Ei
语种: 英语
卷号: 8911
ISSN号: 0277786X
文章类型: 会议论文
页码: 89110G
Citation statistics:
内容类型: 会议论文
URI标识: http://ir.ioe.ac.cn/handle/181551/7654
Appears in Collections:微电子装备总体研究室(四室)_会议论文

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作者单位: 1. Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu 610209, China
2. Graduate University of Chinese Academy of Sciences, Beijing 100039, China
3. Sichuan University, Chengdu 610065, China

Recommended Citation:
Wang, Nan,Jiang, Wei,Yan, Wei,et al. An algorithm for restoring the wafer surface based on B-spline surface reconstruction[C]. 见:Proceedings of SPIE: International Symposium on Photoelectronic Detection and Imaging 2013: Micro/Nano Optical Imaging Technologies and Applications. 2013.
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