| Alignment for double-side deep-exposure lithography tool | |
| Ma Ping; Fu Xiaofang; Yang Chunli; Hu Song; Tang Xiaoping | |
| Volume | 7657 |
| Pages | 76571W (6 pp.) |
| 2010 | |
| Language | 英语 |
| Indexed By | Ei ; ISTP |
| Subtype | 会议论文 |
| Abstract | The paper presents and discusses several prevalent methods for lithography alignment, and then describes and emphasizes the principle, mechanical structure and alignment procedure of the bottom-side alignment (BSA) system for deep-exposure lithography tool. Also, the error source degrading the precision of the alignment system is analyzed. Other related techniques and methods are provided. In the end, the aligned reticle image shows that the system is proved to be stable, reliable and capable of meeting the required precision when it is applied to DUV double-side deep-exposure mask aligner.; The paper presents and discusses several prevalent methods for lithography alignment, and then describes and emphasizes the principle, mechanical structure and alignment procedure of the bottom-side alignment (BSA) system for deep-exposure lithography tool. Also, the error source degrading the precision of the alignment system is analyzed. Other related techniques and methods are provided. In the end, the aligned reticle image shows that the system is proved to be stable, reliable and capable of meeting the required precision when it is applied to DUV double-side deep-exposure mask aligner. |
| Conference Name | Proceedings of the SPIE - The International Society for Optical Engineering |
| Conference Date | 2010 |
| Document Type | 会议论文 |
| Identifier | http://ir.ioe.ac.cn/handle/181551/7635 |
| Collection | 微电子装备总体研究室（四室） |
| Corresponding Author | Ma Ping |
| Affiliation | 中国科学院光电技术研究所 |
| Recommended Citation GB/T 7714 | Ma Ping,Fu Xiaofang,Yang Chunli,et al. Alignment for double-side deep-exposure lithography tool[C],2010:76571W (6 pp.). |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| 2010-223.pdf（608KB） | 会议论文 | 开放获取 | CC BY-NC-SA | Application Full Text | ||
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