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Alignment for double-side deep-exposure lithography tool
Ma Ping; Fu Xiaofang; Yang Chunli; Hu Song; Tang Xiaoping
Volume7657
Pages76571W (6 pp.)
2010
Language英语
Indexed ByEi ; ISTP
Subtype会议论文
AbstractThe paper presents and discusses several prevalent methods for lithography alignment, and then describes and emphasizes the principle, mechanical structure and alignment procedure of the bottom-side alignment (BSA) system for deep-exposure lithography tool. Also, the error source degrading the precision of the alignment system is analyzed. Other related techniques and methods are provided. In the end, the aligned reticle image shows that the system is proved to be stable, reliable and capable of meeting the required precision when it is applied to DUV double-side deep-exposure mask aligner.; The paper presents and discusses several prevalent methods for lithography alignment, and then describes and emphasizes the principle, mechanical structure and alignment procedure of the bottom-side alignment (BSA) system for deep-exposure lithography tool. Also, the error source degrading the precision of the alignment system is analyzed. Other related techniques and methods are provided. In the end, the aligned reticle image shows that the system is proved to be stable, reliable and capable of meeting the required precision when it is applied to DUV double-side deep-exposure mask aligner.
Conference NameProceedings of the SPIE - The International Society for Optical Engineering
Conference Date2010
Document Type会议论文
Identifierhttp://ir.ioe.ac.cn/handle/181551/7635
Collection微电子装备总体研究室(四室)
Corresponding AuthorMa Ping
Affiliation中国科学院光电技术研究所
Recommended Citation
GB/T 7714
Ma Ping,Fu Xiaofang,Yang Chunli,et al. Alignment for double-side deep-exposure lithography tool[C],2010:76571W (6 pp.).
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