| Orthogonal experiment and analysis on process parameters of bowl feed polishing (BFP) | |
| Kai, Meng1,2; Yongjian, Wan1; Qinglan, Xu1; Zhang, Yang3 | |
| Volume | 8911 |
| Pages | 89110Q |
| 2013 | |
| Language | 英语 |
| ISSN | 0277786X |
| DOI | 10.1117/12.2034686 |
| Indexed By | Ei |
| Subtype | 会议论文 |
| Abstract | With the development of science and technology, the demand for high-precision product is increasing continuously. Ultra-smooth surface with sub-nanometer roughness has extensive applications in the field of soft X-ray optics, high power laser and laser gyro. Bowl feed polishing (BFP) technology is an effective ultra-smooth surface processing method, but the polishing process of BFP which is affected by a lot of factors is extremely complex and difficult to control. It is important to understand the effect of the process variables such as abrasive particle size, concentration of abrasive particle, speed of polishing pad, acidity and polishing time in the process of BFP. They are very important parameters that must be carefully formulated to achieve desired material removal rates and surface roughness. Using a design of experiment (DOE) approach, this study was performed investigating the main effect of the each parameter during K9 BFP. A better understanding of the interaction behavior between the various parameters and the effect on removal rate and surface roughness is achieved by using the statistical analysis techniques. In the experimental tests, the optimized parameters combination for BFP which were derived from the statistical analysis could be found for material removal rate and better surface roughness through the above experiment results. © 2013 SPIE.; With the development of science and technology, the demand for high-precision product is increasing continuously. Ultra-smooth surface with sub-nanometer roughness has extensive applications in the field of soft X-ray optics, high power laser and laser gyro. Bowl feed polishing (BFP) technology is an effective ultra-smooth surface processing method, but the polishing process of BFP which is affected by a lot of factors is extremely complex and difficult to control. It is important to understand the effect of the process variables such as abrasive particle size, concentration of abrasive particle, speed of polishing pad, acidity and polishing time in the process of BFP. They are very important parameters that must be carefully formulated to achieve desired material removal rates and surface roughness. Using a design of experiment (DOE) approach, this study was performed investigating the main effect of the each parameter during K9 BFP. A better understanding of the interaction behavior between the various parameters and the effect on removal rate and surface roughness is achieved by using the statistical analysis techniques. In the experimental tests, the optimized parameters combination for BFP which were derived from the statistical analysis could be found for material removal rate and better surface roughness through the above experiment results. © 2013 SPIE. |
| Conference Name | Proceedings of SPIE: International Symposium on Photoelectronic Detection and Imaging 2013: Micro/Nano Optical Imaging Technologies and Applications |
| Conference Date | 2013 |
| Citation statistics | |
| Document Type | 会议论文 |
| Identifier | http://ir.ioe.ac.cn/handle/181551/7604 |
| Collection | 先光中心 |
| Affiliation | 1. Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu 610209, China 2. University of Chinese Academy of Sciences, Beijing 100039, China 3. College of Electronics and Information Engineering, Sichuan University, Chengdu 610064, China |
| Recommended Citation GB/T 7714 | Kai, Meng,Yongjian, Wan,Qinglan, Xu,et al. Orthogonal experiment and analysis on process parameters of bowl feed polishing (BFP)[C],2013:89110Q. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| 2013-2100.pdf（499KB） | 会议论文 | 开放获取 | CC BY-NC-SA | Application Full Text | ||
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment