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Adjustment strategy for inclination moiré fringes in lithography by spatial frequency decomposition
Zhu, Jiangping1; Hu, Song2; Su, Xianyu1; You, Zhisheng1
Source PublicationIEEE Photonics Technology Letters
Volume27Issue:4
2015
Language英语
ISSN1041-1135
DOI10.1109/LPT.2014.2370072
Indexed BySCI ; Ei
WOS IDWOS:000349111700002
Subtype期刊论文
AbstractThe recently proposed four-quadrant grating Moiré fringe alignment scheme was demonstrated to have the potential of achieving nanometer alignment for proximity lithography. The mask-wafer misalignment was accurately detected by comparing the phase between two sets of Moiré fringes averaged along with the fringe direction, making the inclination adjustment of Moiré fringes highly imperative. The inclination closely related with the included angle between mask (alignment mark) and wafer (alignment mark) largely influences the alignment accuracy. To solve this issue, we present an adjustment strategy based on the spatial frequency decomposition of two sets of differential Moiré fringes, by which the included angle can be accurately adjusted with an accuracy of better than 10-5rad. The subsequent discussion indicates that the position of imaging system can be responsible for the inclination but actually it would not affect the mask-wafer alignment, so that our proposed adjustment strategy can be operated simply and feasibly, which is validated by the theoretical analysis and experimental results. © 2014 IEEE.; The recently proposed four-quadrant grating Moiré fringe alignment scheme was demonstrated to have the potential of achieving nanometer alignment for proximity lithography. The mask-wafer misalignment was accurately detected by comparing the phase between two sets of Moiré fringes averaged along with the fringe direction, making the inclination adjustment of Moiré fringes highly imperative. The inclination closely related with the included angle between mask (alignment mark) and wafer (alignment mark) largely influences the alignment accuracy. To solve this issue, we present an adjustment strategy based on the spatial frequency decomposition of two sets of differential Moiré fringes, by which the included angle can be accurately adjusted with an accuracy of better than 10-5rad. The subsequent discussion indicates that the position of imaging system can be responsible for the inclination but actually it would not affect the mask-wafer alignment, so that our proposed adjustment strategy can be operated simply and feasibly, which is validated by the theoretical analysis and experimental results. © 2014 IEEE.
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Cited Times:2[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.ioe.ac.cn/handle/181551/7325
Collection微电子装备总体研究室(四室)
Corresponding AuthorYou, Zhisheng
Affiliation1. School of Computer Science and Technology, Sichuan University, Chengdu, China
2. State Key Laboratory of Optical Technologies for Microfabrication, Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu, China
Recommended Citation
GB/T 7714
Zhu, Jiangping,Hu, Song,Su, Xianyu,et al. Adjustment strategy for inclination moiré fringes in lithography by spatial frequency decomposition[J]. IEEE Photonics Technology Letters,2015,27(4).
APA Zhu, Jiangping,Hu, Song,Su, Xianyu,&You, Zhisheng.(2015).Adjustment strategy for inclination moiré fringes in lithography by spatial frequency decomposition.IEEE Photonics Technology Letters,27(4).
MLA Zhu, Jiangping,et al."Adjustment strategy for inclination moiré fringes in lithography by spatial frequency decomposition".IEEE Photonics Technology Letters 27.4(2015).
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