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稀疏子孔径采样检测大口径光学器件
闫锋涛; 范斌; 侯溪; 伍凡
Source Publication强激光与粒子束
Volume23Issue:12Pages:3193-3196
2011
Language中文
Subtype期刊论文
Abstract针对大口径光学器件在抛光加工过程中子孔径拼接检测效率低的问题,提出并分析了用稀疏子孔径采样法对大口径光学器件抛光加工过程进行过程检测。通过软件仿真分析稀疏子孔径不同的采样分布,并拟合出不同采样分布的全口径面形,与实际测得全口径面形进行比较。结果表明:当稀疏子孔径采样分布合理时,稀疏子孔径采样检测法检测出的全口径面形与实际测量的全口径面形相当,所以稀疏子孔径采样检测法可以在抛光过程中进行检测,从而提高检测效率
Document Type期刊论文
Identifierhttp://ir.ioe.ac.cn/handle/181551/6993
Collection先光中心
Corresponding Author闫锋涛
Affiliation中国科学院光电技术研究所
Recommended Citation
GB/T 7714
闫锋涛,范斌,侯溪,等. 稀疏子孔径采样检测大口径光学器件[J]. 强激光与粒子束,2011,23(12):3193-3196.
APA 闫锋涛,范斌,侯溪,&伍凡.(2011).稀疏子孔径采样检测大口径光学器件.强激光与粒子束,23(12),3193-3196.
MLA 闫锋涛,et al."稀疏子孔径采样检测大口径光学器件".强激光与粒子束 23.12(2011):3193-3196.
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