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基于APDL的PCB元件布局优化
刘文广; 吴凡
Source Publication电子工艺技术
Volume30Issue:3Pages:151-153
2009
Language中文
Subtype期刊论文
Abstract随着电子设备集成度的不断提高和功耗的不断加大,电子元器件的发热密度也越来越高,相应地电子产品的过热问题也变得越来越重要.应用热仿真技术,可以在电路板的设计阶段获得其温度分布及最高温度值,通过优化设计,可以降低
Document Type期刊论文
Identifierhttp://ir.ioe.ac.cn/handle/181551/5094
Collection光电传感技术研究室(六室)
Corresponding Author刘文广
Affiliation中国科学院光电技术研究所
Recommended Citation
GB/T 7714
刘文广,吴凡. 基于APDL的PCB元件布局优化[J]. 电子工艺技术,2009,30(3):151-153.
APA 刘文广,&吴凡.(2009).基于APDL的PCB元件布局优化.电子工艺技术,30(3),151-153.
MLA 刘文广,et al."基于APDL的PCB元件布局优化".电子工艺技术 30.3(2009):151-153.
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