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Resolution and stability analysis of localized surface plasmon lithography on the geometrical parameters of soft mold.
Yukun Zhang; JinglEi Du; Xingzhan WEi; Lifang Shi; Qiling Deng; Xiaochun Dong; ChunlEi Du.
Source PublicationApplied Optics
Volume50Issue:13Pages:1963-1967
2011
Language英语
Subtype期刊论文
AbstractWe have recently shown that patterns with 30nm line width and micrometer scale periodicity could be steadily fabricated by employing localized surface plasmons lithography based on a soft mold [Opt. Lett. 35, 13 (2009)]. In this paper, the dependence of the resolution (pattern periodicity), critical dimension, and electric field intensity on the geometrical parameters of the soft mold, such as ridge width, mold periodicity, ridge depth, and slope, have been systematically studied and analyzed. The relevant simulation results by finite-difference time-domain demonstrate that the critical dimension exhibits a perfect stabilization and the value of electric field intensity would be especially large, when the ridge depth is in the range from 100 to 270nm and the slope angle is below 35°. Importantly, the optimal resolution and critical dimension can reach 100 and 17 nm, respectively, by reasonably designing the corresponding mold periodicity and ridge width, which indicates that the method is particularly suitable for obtaining patterns with high density and is extremely promising for bio-sensing and photonic crystals application. © 2011 Optical Society of America. (23 refs.); We have recently shown that patterns with 30nm line width and micrometer scale periodicity could be steadily fabricated by employing localized surface plasmons lithography based on a soft mold [Opt. Lett. 35, 13 (2009)]. In this paper, the dependence of the resolution (pattern periodicity), critical dimension, and electric field intensity on the geometrical parameters of the soft mold, such as ridge width, mold periodicity, ridge depth, and slope, have been systematically studied and analyzed. The relevant simulation results by finite-difference time-domain demonstrate that the critical dimension exhibits a perfect stabilization and the value of electric field intensity would be especially large, when the ridge depth is in the range from 100 to 270nm and the slope angle is below 35°. Importantly, the optimal resolution and critical dimension can reach 100 and 17 nm, respectively, by reasonably designing the corresponding mold periodicity and ridge width, which indicates that the method is particularly suitable for obtaining patterns with high density and is extremely promising for bio-sensing and photonic crystals application. © 2011 Optical Society of America. (23 refs.)
Document Type期刊论文
Identifierhttp://ir.ioe.ac.cn/handle/181551/4983
Collection微电子装备总体研究室(四室微光学)
Corresponding AuthorYukun Zhang
Affiliation中国科学院光电技术研究所
Recommended Citation
GB/T 7714
Yukun Zhang,JinglEi Du,Xingzhan WEi,et al. Resolution and stability analysis of localized surface plasmon lithography on the geometrical parameters of soft mold.[J]. Applied Optics,2011,50(13):1963-1967.
APA Yukun Zhang.,JinglEi Du.,Xingzhan WEi.,Lifang Shi.,Qiling Deng.,...&ChunlEi Du..(2011).Resolution and stability analysis of localized surface plasmon lithography on the geometrical parameters of soft mold..Applied Optics,50(13),1963-1967.
MLA Yukun Zhang,et al."Resolution and stability analysis of localized surface plasmon lithography on the geometrical parameters of soft mold.".Applied Optics 50.13(2011):1963-1967.
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