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Superlens imaging lithography for high aspect ratio sub-wavelength pattern employing trilayer resist process
Fang, Liang; Pan, Li; Wang, Changtao; Luo, Xiangang
Source PublicationMICROELECTRONIC ENGINEERING
Volume110Pages:35-39
2013-10-01
Language英语
Indexed BySCI
WOS IDWOS:000326003600007
SubtypeArticle
AbstractRecently, superlens imaging lithography below the diffraction limit has been experimentally verified. However, the short exposure depth owing to the near-field attribute of this method restricts its practical application. A tri-layer resist process, which increases the pattern depth through two-step dry etching, can overcome this drawback. In this paper, we investigated the scheme of superlens imaging lithography employing a tri-layer resist process and analysed the effect of the air gap between the object and the photosensitive layer on the exposure depth by finite-difference time-domain analyses. Through optimising the three layer resist thicknesses and dry-etching parameters of the tri-layer resist process, we patterned a high aspect ratio structure with half pitch of 110 nm and depth of 400 nm in our experiment. (C) 2013 Elsevier B.V. All rights reserved.
KeywordSuper Lens Surface Plasmon Lithography Tr-layer Resist Process
WOS KeywordDIFFRACTION LIMIT ; OPTICAL HYPERLENS ; SILVER SUPERLENS ; BILAYER RESIST ; PERFECT LENS ; REFRACTION ; LAYER
WOS Research AreaEngineering ; Science & Technology - Other Topics ; Optics ; Physics
WOS SubjectEngineering, Electrical & Electronic ; Nanoscience & Nanotechnology ; Optics ; Physics, Applied
Citation statistics
Cited Times:4[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.ioe.ac.cn/handle/181551/1186
Collection光电技术研究所被WoS收录文章
AffiliationChinese Acad Sci, Inst Opt & Elect, State Key Lab Opt Technol Microfabricat, Chengdu 610209, Peoples R China
Recommended Citation
GB/T 7714
Fang, Liang,Pan, Li,Wang, Changtao,et al. Superlens imaging lithography for high aspect ratio sub-wavelength pattern employing trilayer resist process[J]. MICROELECTRONIC ENGINEERING,2013,110:35-39.
APA Fang, Liang,Pan, Li,Wang, Changtao,&Luo, Xiangang.(2013).Superlens imaging lithography for high aspect ratio sub-wavelength pattern employing trilayer resist process.MICROELECTRONIC ENGINEERING,110,35-39.
MLA Fang, Liang,et al."Superlens imaging lithography for high aspect ratio sub-wavelength pattern employing trilayer resist process".MICROELECTRONIC ENGINEERING 110(2013):35-39.
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